Key Product Design Features

• Front (Substrate) Glass
  Heat strengthened through a quenching process to withstand handling and thermally induced stresses and avoid breakage over the 25+ year module life.
  
  
• Semiconductor
  Compound semiconductor forms a strong molecular bond that is not readily soluble or combustible.
  
  
• Metal Conductor
  Provides an additional seal between the semiconductor and the environment, even if the glass were to break or crack.
  
  
• EVA
  Used to bond the cover glass to the substrate over the 25+ year anticipated life of the module, sealing the photovoltaic device from the environment.
  
  
• Back (Cover) Glass
  Tempered to withstand handling and thermally induced stresses and avoid breakage over the 25+ year module life.