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 | Collection |
| | The modules are collected in hoppers and loaded by forklift into a shredder. |
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 | Shredder |
| | The modules are reduced in size in a two-step process. Step one uses a shredder to break the modules into large pieces. |
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 | Hammermill |
| | Step-two, the hammermill, crushes the broken glass into 4-5mm pieces, small enough to ensure the lamination bond is broken. |
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 | Film Removal |
| | The semiconductor films are removed by the addition of acid and hydrogen peroxide in a slowly rotating, stainless steel drum. |
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 | Solid-Liquid Separation |
| | The drum is slowly emptied into a classifier where glass is separated from the liquids. A rotating screw conveys the glass up an incline, leaving the liquids behind. |
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 | Glass-Laminate Material Separation |
| | A vibrating screen separates the glass from the larger pieces of laminate material (which formerly sealed the two pieces of glass together). |
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 | Glass Rinsing |
| | The glass is rinsed to remove any residual semiconductor material that physically remains on the glass. The cleaned glass is packaged for recycling. |
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 | Precipitation |
| | The metals-rich liquid is pumped to the precipitation unit. The metal compounds are precipitated in three stages at increasing pH. |
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 | Dewatering |
| | The precipitated materials are concentrated in a thickening tank. The resulting unrefined semiconductor material is packaged for processing by a third party to create semiconductor material for use in new modules. |